As generative AI and collaborative robots are implemented in society, communication infrastructure must simultaneously meet the demands for real-time responsiveness and ultra-high reliability. This presentation introduces the development of a TSN-enabled local 5G system, aligned with URLLC and TSN requirements as enhanced in 3GPP Release 19, and a custom low-latency communication semiconductor chip scheduled for commercial launch in 2025. It also explains efforts to achieve infrastructure efficiency and ultra-low latency communication through Watt-Bit integration—coordinated deployment of communication and power infrastructure. Technical challenges such as millisecond-level latency control and time synchronization will be discussed along with verification results using AGVs and industrial robots.

Looking ahead to the 6G era, more advanced real-time coordination will be required. This session will also touch on the roadmap for ongoing semiconductor development and explore the evolution of communication technologies as the foundation for next-generation smart infrastructure.